The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2014
Filed:
Apr. 22, 2011
Applicants:
Katsuhiro Kojima, Otake, JP;
Tadashi Nakamura, Tokyo, JP;
Inventors:
Katsuhiro Kojima, Otake, JP;
Tadashi Nakamura, Tokyo, JP;
Assignee:
Mitsubishi Rayon Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22D 7/10 (2006.01); C25D 11/04 (2006.01); C25D 11/24 (2006.01); B29D 11/00 (2006.01); G02B 1/11 (2006.01); B81C 99/00 (2010.01); B29C 33/42 (2006.01); G02B 27/00 (2006.01); C25D 11/12 (2006.01);
U.S. Cl.
CPC ...
G02B 1/118 (2013.01); C25D 11/045 (2013.01); C25D 11/24 (2013.01); B29D 11/00788 (2013.01); B29D 11/0048 (2013.01); B81C 99/009 (2013.01); B29C 33/424 (2013.01); G02B 27/0006 (2013.01); C25D 11/12 (2013.01);
Abstract
A mold in which a fine uneven structure is formed on the surface by anodizing a surface of an aluminum base material having a purity of equal to or more than 99.5% by mass, wherein a 60-degree gloss of the surface on the side where a fine uneven structure is formed is equal to or more than 750%.