The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 09, 2014

Filed:

Feb. 06, 2013
Applicant:

Silicon Motion, Inc., Jhubei, Hsinchu County, TW;

Inventor:

Yu-Wei Chyan, Hsinchu, TW;

Assignee:

Silicon Motion, Inc., Jhubei, Hsinchu County, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 21/79 (2013.01); G06F 21/70 (2013.01); G06F 21/78 (2013.01);
U.S. Cl.
CPC ...
G06F 21/70 (2013.01); G06F 21/78 (2013.01);
Abstract

An embedded MultiMediaCard (eMMC), an electronic device equipped with an eMMC and an eMMC engineering board are disclosed. The eMMC includes an eMMC substrate plate, a plurality of solder balls and an eMMC chip. The solder balls are soldered to the eMMC substrate plate, and, one of the solder balls is designed as a security protection enable/disable solder ball. The eMMC chip is bound to the eMMC substrate plate, and, the eMMC chip has a security protection enable/disable pin electrically connected to the security protection enable/disable solder ball. The security protection enable/disable pin is internally pulled high by the eMMC chip when the security protection enable/disable solder ball is floating. When the security protection enable/disable solder ball is coupled to ground, the eMMC is protected from software-based attacks.


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