The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 09, 2014

Filed:

Aug. 01, 2011
Applicants:

Paul Firth, Caswell Towcester, GB;

Stephan Gardner, Caswell Towcester, GB;

Inventors:

Paul Firth, Caswell Towcester, GB;

Stephan Gardner, Caswell Towcester, GB;

Assignee:

Oclaro Technology Limited, Northamptonshire, GB;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 3/04 (2006.01); H01S 5/022 (2006.01); H01S 3/10 (2006.01); G02B 6/42 (2006.01); H01S 5/024 (2006.01); H01S 5/042 (2006.01);
U.S. Cl.
CPC ...
H01S 3/10 (2013.01); H01S 5/02438 (2013.01); H01S 5/02208 (2013.01); H01S 5/02276 (2013.01); H01S 5/0427 (2013.01); H01S 5/02415 (2013.01); H01S 5/02284 (2013.01); G02B 6/4201 (2013.01);
Abstract

An enclosure for a laser package the enclosure being configured to receive a laser component within the enclosure, and further configured to receive for a driver integrated circuit (IC) () on the exterior of the enclosure, wherein the enclosure comprises first external electrical contacts () electrically connected to respective first IC electrical contacts (), and second IC electrical contacts () electrically connected to respective first internal electrical contacts (), wherein the first and second IC electrical contacts () are configured for electrical connection to the driver IC (). Heat dissipation of the driver IC is improved for the IC being mounted outside of the enclosure.


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