The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2014
Filed:
Oct. 31, 2013
Applicant:
Lapis Semiconductor Co., Ltd., Tokyo, JP;
Inventor:
Masakuni Kawagoe, Miyazaki, JP;
Assignee:
Lapis Semiconductor Co., Ltd., Yokohama, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03K 3/00 (2006.01); H03K 5/13 (2014.01); H03L 7/00 (2006.01); G06F 17/50 (2006.01); H03K 3/037 (2006.01);
U.S. Cl.
CPC ...
H03L 7/00 (2013.01); G06F 17/5059 (2013.01); H03K 5/133 (2013.01); H03K 3/0375 (2013.01);
Abstract
A semiconductor integrated circuit includes a delay circuit connected between a source of data bits and a data input terminal of a latch circuit. The delay circuit includes a first delay section formed by connecting logic devices in series corresponding to a number of logic devices included in a clock signal path between a clock signal source and the latch circuit data input. The delay circuit also includes a second delay section having a delay time equal to an interconnect delay time corresponding to a wiring length of the clock signal path.