The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2014
Filed:
Jul. 17, 2013
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Thomas J. Brunschwiler, Rueschlikon, CH;
Javier V. Goicochea, Rueschlikon, CH;
Stefano S. Oggioni, Segrate, IT;
Gerd Schlottig, Rueschlikon, CH;
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
H01L 21/563 (2013.01); H01L 2924/0002 (2013.01); H01L 2224/16225 (2013.01); H01L 23/3121 (2013.01); H01L 2224/92125 (2013.01); H01L 23/31 (2013.01); H01L 23/295 (2013.01);
Abstract
A method for manufacturing an underfill in a semiconductor chip stack having a cavity between a first surface and a second surface includes providing at least one access hole in one of the first or second surface; providing at least one vent hole in the one of the first or second surfaces; and applying a viscous filling material through the at least one access hole into the cavity thereby squeezing out air or gas through the at least one vent hole.