The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2014
Filed:
Apr. 26, 2011
Applicants:
Kayoko Shibata, Tokyo, JP;
Hiroaki Ikeda, Tokyo, JP;
Inventors:
Kayoko Shibata, Tokyo, JP;
Hiroaki Ikeda, Tokyo, JP;
Assignee:
PS4 Luxco S.a.r.l., Luxembourg, LU;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 25/065 (2006.01); H01L 23/535 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 23/535 (2013.01); H01L 2225/06527 (2013.01); H01L 2223/5444 (2013.01); H01L 25/0657 (2013.01); H01L 2225/06513 (2013.01); H01L 2224/16 (2013.01); H01L 2225/06541 (2013.01); H01L 23/544 (2013.01);
Abstract
A semiconductor device comprising a plurality of semiconductor chips and a plurality of through-line groups is disclosed. Each of the through-line groups consists of a unique number of through-lines. The numbers associated with the through-line groups are mutually coprime to each other. When one of the through-lines is selected for the each through-line group, one of the semiconductor chip is designated by a combination of the selected through-lines of the plurality of the through-line groups.