The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 09, 2014

Filed:

Oct. 28, 2011
Applicants:

Shiun-wei Chan, Hsinchu, TW;

Chih-hsun KE, Hsinchu, TW;

Chao-hsiung Chang, Hsinchu County, TW;

Inventors:

Shiun-Wei Chan, Hsinchu, TW;

Chih-Hsun Ke, Hsinchu, TW;

Chao-Hsiung Chang, Hsinchu County, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/54 (2010.01); H01L 33/64 (2010.01); H05K 1/02 (2006.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 33/486 (2013.01); H05K 1/0204 (2013.01); H05K 2201/10416 (2013.01); H05K 2201/10106 (2013.01); H01L 2924/1815 (2013.01); H01L 33/54 (2013.01); H01L 2224/48091 (2013.01);
Abstract

An LED package includes a light transmissive encapsulation, an LED die embedded in the encapsulation from a bottom surface of the encapsulation, a positive electrode electrically connected to an anode of the LED die, and a negative electrode electrically connected to a cathode of the LED die. The encapsulation includes a light emitting surface opposite to the bottom surface thereof. The LED die includes a front surface for outputting light outward, and a back surface opposite to the front surface. The front surface is covered by the encapsulation and faces the light emitting surface of the encapsulation. The back surface is exposed outside. A light emitting device is provided by mounting the LED package to a circuit board. The circuit board has a heat conductor connecting with the LED die.


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