The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 09, 2014

Filed:

Jan. 20, 2012
Applicants:

Hiroki Sugi, Tokyo, JP;

Bungo Yasui, Tokyo, JP;

Seiji Maeda, Tokyo, JP;

Katsuyuki Ueki, Tokyo, JP;

Kenshiro Shimada, Tokyo, JP;

Inventors:

Hiroki Sugi, Tokyo, JP;

Bungo Yasui, Tokyo, JP;

Seiji Maeda, Tokyo, JP;

Katsuyuki Ueki, Tokyo, JP;

Kenshiro Shimada, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 175/08 (2006.01); C08G 18/08 (2006.01); C08L 63/02 (2006.01); C08G 18/48 (2006.01); C08G 18/42 (2006.01); C08G 18/32 (2006.01); C08G 18/76 (2006.01); C09J 175/06 (2006.01); C08G 18/75 (2006.01); C08G 18/10 (2006.01); C08G 18/73 (2006.01); C08G 18/58 (2006.01); C08G 18/72 (2006.01); C09J 11/06 (2006.01); C08G 18/40 (2006.01);
U.S. Cl.
CPC ...
C09J 175/08 (2013.01); C08G 18/4841 (2013.01); C08G 18/4238 (2013.01); C08G 18/3206 (2013.01); C08G 18/7671 (2013.01); C09J 175/06 (2013.01); C08G 18/755 (2013.01); C08G 18/10 (2013.01); C08G 18/7621 (2013.01); C08G 18/73 (2013.01); C08G 18/58 (2013.01); C08G 18/4854 (2013.01); C08G 18/722 (2013.01); C09J 11/06 (2013.01); C08G 18/4045 (2013.01);
Abstract

The present invention is to provide an adhesive agent composition, including: a main agent containing a polyether polyurethane polyol and a bisphenol A-type epoxy resin; and a curing agent, wherein the polyether polyurethane polyol is obtained by reacting a polyalkylene glycol including repeating units each having a carbon number of 3 or 4 and an alkane diol monomer with an organic diisocyanate at an equivalent ratio (NCO/OH) of 0.7 or more but less than 1, a weight average molecular weight thereof is in the range of 20,000 to 70,000, and an urethane bond equivalent thereof is in the range of 320 to 600 g/eq, and wherein a number average molecular weight of the bisphenol A-type epoxy resin is in the range of 400 to 5,000, and the bisphenol A-type epoxy resin is of a solid state or a semisolid state at normal temperature.


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