The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2014
Filed:
Jun. 17, 2011
Applicants:
Yewchung Sermon Wu, Hsinchu, TW;
Bau-ming Wang, Hsinchu, TW;
Feng-ching Hsiao, Hsinchu, TW;
Inventors:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01); H01L 21/46 (2006.01); H01L 21/02 (2006.01); H01L 21/18 (2006.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 21/02658 (2013.01); H01L 21/0237 (2013.01); H01L 21/02458 (2013.01); H01L 21/0254 (2013.01); H01L 21/02664 (2013.01); H01L 21/02639 (2013.01); H01L 21/187 (2013.01); H01L 33/0079 (2013.01);
Abstract
The present invention related to a method for manufacturing a semiconductor, comprising steps of: providing a growing substrate; forming a semiconductor substrate on the growing substrate; forming a first structure with plural grooves and between the growing substrate and the semiconductor substrate; and changing the temperature of the growing substrate and the semiconductor substrate.