The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2014
Filed:
Mar. 13, 2013
Samsung Electronics Co., Ltd., Suwon-si, KR;
Shinhye Kim, Suwon-si, KR;
Sangho Rha, Suwon-si, KR;
Jeong-Kyu Lee, Incheon, KR;
Zulkarnain, Yongin-si, KR;
Kyungseok Oh, Seoul, KR;
Sangbom Kang, Seoul, KR;
Seungjae Lee, Hwaseong-si, KR;
Jungchan Lee, Suwon-si, KR;
Abstract
A semiconductor device is manufactured using an expandable material. The method includes forming a first gate insulating layer on a substrate, forming first and second gate structures on the first gate insulating layer, the first and second gate structures being spaced apart from each other at a distance, forming an expandable material on sidewalls and upper surfaces of the first and second gate structures, forming a gap-fill layer on the expandable material between the first and second gate structures, and performing a heat-treatment process to increase the volume of the expandable material.