The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2014
Filed:
Jan. 02, 2012
Fabrice Jacquet, Saint Pierre de Mesage, FR;
David Henry, Saint Ismier, FR;
Fabrice Jacquet, Saint Pierre de Mesage, FR;
David Henry, Saint Ismier, FR;
Abstract
A method for encapsulating a microcomponent positioned on a substrate, including: a) production of an electrical contact pad on the substrate; b) production of a portion of sacrificial material covering the microcomponent and the electrical contact pad; c) production of an encapsulation layer covering the sacrificial material and a first face of the substrate; d) production, through the substrate, of a hole aligned with the electrical contact pad and emerging at the portion of sacrificial material; e) elimination of the portion of sacrificial material through the hole; f) production, in the hole, of a conductive portion electrically connected to the electrical contact pad, forming a conductive via.