The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2014
Filed:
May. 08, 2012
Sei-ping Louh, New Taipei, TW;
Sei-Ping Louh, New Taipei, TW;
Hon Hai Precision Industry Co., Ltd., New Taipei, TW;
Abstract
The present application provides a method and semiconductor packaging structure comprising a conductive substrate having a first surface, a first lateral surface and a second lateral surface adjacent to the first surface. A first electrode line with two ends are provided on the first surface and the first lateral surface, and a second electrode line with two ends are provided on the first surface and a second lateral surface respectively. A semiconductor device is provided on the first surface of the conductive substrate which electrically connected to the first electrode line and the second electrode line, a protective plate with through holes covers the first surface, and a sheathing overlays the semiconductor device.