The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2014
Filed:
Apr. 20, 2011
Applicants:
Tomohiro Sato, Osaka, JP;
Yoshimasa Hirai, Osaka, JP;
Toru Maruyama, Suita, JP;
Takeshi Kobayashi, Settsu, JP;
Inventors:
Tomohiro Sato, Osaka, JP;
Yoshimasa Hirai, Osaka, JP;
Toru Maruyama, Suita, JP;
Takeshi Kobayashi, Settsu, JP;
Assignee:
Kurimoto, Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22C 29/00 (2006.01); C22C 32/00 (2006.01); C22C 1/04 (2006.01); C22C 9/02 (2006.01); B22F 7/02 (2006.01); B22F 7/08 (2006.01); B22F 9/08 (2006.01); C22C 9/00 (2006.01); C22C 9/10 (2006.01);
U.S. Cl.
CPC ...
C22C 1/0425 (2013.01); C22C 32/0089 (2013.01); C22C 9/02 (2013.01); C22C 9/00 (2013.01); B22F 7/02 (2013.01); B22F 7/08 (2013.01); F16C 2220/20 (2013.01); F16C 2204/12 (2013.01); B22F 9/082 (2013.01);
Abstract
A copper alloy having excellent sliding performance is produced without relying on lead or molybdenum. The copper alloy contains a sintered CuFeSmaterial produced by sintering a raw material powder that comprises Cu, Fe and S and is produced by a gas atomizing method.