The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 09, 2014

Filed:

Mar. 15, 2012
Applicants:

Hankyu Cho, Seoul, KR;

Jaehwan Kim, Seoul, KR;

Dongki Paik, Seoul, KR;

Inventors:

Hankyu Cho, Seoul, KR;

Jaehwan Kim, Seoul, KR;

Dongki Paik, Seoul, KR;

Assignee:

LG Electronics Inc., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 29/00 (2006.01); F21V 15/06 (2006.01); F21V 3/00 (2006.01); F21K 99/00 (2010.01); F21V 23/00 (2006.01); F21Y 101/02 (2006.01); F21V 17/10 (2006.01); F21Y 111/00 (2006.01);
U.S. Cl.
CPC ...
F21V 23/009 (2013.01); F21V 15/06 (2013.01); F21Y 2101/02 (2013.01); F21V 3/00 (2013.01); F21K 9/135 (2013.01); F21V 29/2231 (2013.01); F21V 17/10 (2013.01); F21Y 2111/007 (2013.01); F21V 29/2237 (2013.01);
Abstract

A lighting apparatus is disclosed. The lighting apparatus may include a heat sink, an LED module provided on the heat sink, an enclosure provided over the heat sink to surround the LED module, an insulator provided between the heat sink and the enclosure, a power module provided below the heat sink to provide power to the LED module, a housing attached to the heat sink to house the power module, and a power socket mounted to the housing and electrically connected to the electronic module. The heat sink may include a channel formed to correspond to a shape of the enclosure and the insulator may be provided in the channel, the insulator and the enclosure being formed of different materials.


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