The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 09, 2014

Filed:

Jul. 15, 2010
Applicants:

Uttam Ghoshal, Austin, TX (US);

Ayan Guha, Austin, TX (US);

Inventors:

Uttam Ghoshal, Austin, TX (US);

Ayan Guha, Austin, TX (US);

Assignee:

Sheetak, Inc., Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F25B 21/02 (2006.01); F28D 15/02 (2006.01); F28D 15/04 (2006.01); H01L 35/30 (2006.01);
U.S. Cl.
CPC ...
F28D 15/0275 (2013.01); F25B 21/02 (2013.01); F28D 15/0266 (2013.01); F28D 15/04 (2013.01); H01L 35/30 (2013.01); F25B 2321/025 (2013.01);
Abstract

In various embodiments of the present invention, a thermoelectric cooling device with a thermoelectric device, heat pipe and a heat sink is provided. The thermoelectric device is connected to a chamber through a metal standoff. The chamber contains a fluid that needs to be cooled. The metal standoff has a shape, e.g. a bevel shape, to minimize heat leakage into the fluid. The heat pipes are preferably connected to the thermoelectric device with a Thermal Interface Material (TIM). In one embodiment, the heat pipes are attached to the thermoelectric device through screws which have an insulating standoff so as to minimize heat leakage into the fluid. In another embodiment of the present invention, two stage thermoelectric cooling devices with multiple heat pipes and common heat sink are provided to cool the fluid.


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