The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 09, 2014

Filed:

Mar. 09, 2012
Applicants:

IN Hwan Ryu, Ansan-si, KR;

Hak Pyo Lee, Ansan-si, KR;

IL Chan Yang, Ansan-si, KR;

Ho Joong Lee, Seoul, KR;

Inventors:

In Hwan Ryu, Ansan-si, KR;

Hak Pyo Lee, Ansan-si, KR;

Il Chan Yang, Ansan-si, KR;

Ho Joong Lee, Seoul, KR;

Assignees:

LG CNS Co. Ltd., Seoul, KR;

Robostar Co., Ltd., Ansan-si, KR;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23P 19/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A light-emitting diode (LED) wafer picker that may increase a suction force and may perform stable adsorption without a concern for contact with a top surface of an LED wafer is provided. An LED wafer picker may include a main body to hold, in an adsorbed state, an LED wafer disposed below the main body, when air drawn in from a top of the LED wafer picker is discharged along a streamlined discharge surface to both sides of the LED wafer picker, a guide member to enable the air to flow along the discharge surface, the guide member being disposed below the discharge surface, a single central hole formed in a central portion of the guide member, excluding a portion facing the discharge surface, and a support portion to support the LED wafer, the support portion extending downward from the guide member. Accordingly, it is possible to easily perform adsorption of an LED wafer that is relatively far from the LED wafer picker. Additionally, it is possible to prevent the top surface of the LED wafer from coming into contact with the guide member, thereby reducing detects due to contamination of foreign substances.


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