The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2014

Filed:

Feb. 22, 2012
Applicants:

Jochen Zoellin, Stuttgart, DE;

Ricardo Ehrenpfordt, Korntal-Muenchingen, DE;

Ulrike Scholz, Korntal, DE;

Inventors:

Jochen Zoellin, Stuttgart, DE;

Ricardo Ehrenpfordt, Korntal-Muenchingen, DE;

Ulrike Scholz, Korntal, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H04R 25/00 (2006.01); H04R 9/08 (2006.01); H04R 11/04 (2006.01); H04R 17/02 (2006.01); H04R 19/04 (2006.01); H04R 21/02 (2006.01); G01L 19/00 (2006.01); B81B 7/00 (2006.01); G01L 19/14 (2006.01); H04R 19/00 (2006.01); H04R 1/08 (2006.01);
U.S. Cl.
CPC ...
H04R 19/005 (2013.01); B81B 2207/096 (2013.01); H04R 19/04 (2013.01); H04R 1/086 (2013.01); G01L 19/0084 (2013.01); B81B 2201/0257 (2013.01); B81B 7/007 (2013.01); G01L 19/141 (2013.01); B81B 2207/097 (2013.01); B81B 2201/0264 (2013.01); B81C 2203/0109 (2013.01); B81B 2207/012 (2013.01);
Abstract

A component support allows cost-effective, space-saving and low-stress packaging of MEMS components having a sensitive structure. The component support is suited, in particular, for MEMS components, which are mounted in the cavity of a housing and are intended to be electrically contacted. The component support is produced as a composite part in the form of a hollow body open on one side, the composite part being made essentially of a three-dimensionally shaped carrier foil flexible in its shaping, and an encasing material. The encasing material is molded onto one side of the carrier foil, so that the carrier foil is situated on the inner wall of the component support. At least one mounting surface for at least one component is formed on the inner wall having the carrier foil. The carrier foil is also provided with contact surfaces and insulated conductive paths for electrically contacting the at least one component.


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