The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2014
Filed:
Feb. 12, 2013
Applicant:
Stmicroelectronics (Rousset) Sas, Rousset, FR;
Inventors:
Albert Martinez, Bouc Bel Air, FR;
Pascal Fornara, Pourrieres, FR;
Assignee:
STMicroelectronics (Rousset) SAS, Rousset, FR;
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01); H05K 1/02 (2006.01); H01G 5/16 (2006.01); H01H 1/00 (2006.01); H01H 59/00 (2006.01); H05K 3/30 (2006.01); H01G 5/04 (2006.01);
U.S. Cl.
CPC ...
H05K 1/02 (2013.01); H01G 5/16 (2013.01); H01H 1/0036 (2013.01); H01H 59/0009 (2013.01); H05K 3/30 (2013.01); H01G 5/04 (2013.01);
Abstract
A thermally deformable assembly is formed in an integrated-circuit metallization level. The physical behavior of the metal forming the assembly brings the assembly into contact with a stop-forming body when subjected to a temperature change caused by a current flow. A natural rollback to the initial configuration in which the assembly is a certain distance away from the body is prevented. The state or configuration of the assembly is determined by a capacitive reader.