The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2014
Filed:
Dec. 27, 2011
Yon-hua Tzeng, Tainan, TW;
Chih-yi Liu, New Taipei, TW;
Chen-han Huang, Tainan, TW;
Hsing-ying Lin, Kaohsiung, TW;
Hsiang-chen Chui, Taichung, TW;
Kyaw-oo Lau, Tainan, TW;
Shih-tse Chen, New Taipei, TW;
Cheng-wen Huang, Kaohsiung, TW;
Yon-Hua Tzeng, Tainan, TW;
Chih-Yi Liu, New Taipei, TW;
Chen-Han Huang, Tainan, TW;
Hsing-Ying Lin, Kaohsiung, TW;
Hsiang-Chen Chui, Taichung, TW;
Kyaw-Oo Lau, Tainan, TW;
Shih-Tse Chen, New Taipei, TW;
Cheng-Wen Huang, Kaohsiung, TW;
National Cheng Kung University, Tainan, TW;
Abstract
The present invention relates to a sensor chip for biomedical and micro-nano structured substances and a method for manufacturing the same. The sensor chip includes plural metal nanoparticles and a porous anodized aluminum oxide film. The plural metal nanoparticles are completely contained in holes of the porous anodized aluminum oxide film and located at the bottom of the holes, and an aluminum oxide layer covering the second end of the holes has a thickness of 1 nm to 300 nm. When analytes such as biomedical molecules are provided in contact with the sensor chip, a Raman signal can be detected based on the Raman spectroscopy. The structure of the sensor chip of the present invention is uncomplicated and the manufacturing steps thereof are simple, and therefore the sensor chip of the present invention is of great commercial value. Also, a method of manufacturing the above sensor chip is disclosed.