The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2014

Filed:

Nov. 23, 2011
Applicants:

Satoru Hiramoto, Chita, JP;

Koichiro Matsumoto, Kyoto, JP;

Yoshiyuki Kono, Obu, JP;

Akitoshi Mizutani, Okazaki, JP;

Inventors:

Satoru Hiramoto, Chita, JP;

Koichiro Matsumoto, Kyoto, JP;

Yoshiyuki Kono, Obu, JP;

Akitoshi Mizutani, Okazaki, JP;

Assignee:

Denso Corporation, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/82 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H05K 1/189 (2013.01); H05K 3/3421 (2013.01); H05K 3/3442 (2013.01); H05K 2201/09418 (2013.01);
Abstract

A mounting structure for mounting a chip type electric element on a flexible board includes: the flexible board having a first land, on which a first lead terminal of another electric element is soldered; and the chip type electric element having a long side. A whole of the long side of the chip type electric element faces a long side of the first land. A length of the long side of the first land is defined as IA, and a distance between one long side of the first land and one long side of the chip type electric element is defined as IB, the one long side of the first land facing the chip type electric element but opposite to the one long side of the chip type electric element. The length of IA is equal to or larger than the distance of IB.


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