The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2014
Filed:
Jun. 05, 2012
Hubert Benzel, Pliezhausen, DE;
Frank Henning, Reutlingen, DE;
Armin Scharping, Metzingen, DE;
Christoph Schelling, Stuttgart, DE;
Hubert Benzel, Pliezhausen, DE;
Frank Henning, Reutlingen, DE;
Armin Scharping, Metzingen, DE;
Christoph Schelling, Stuttgart, DE;
Robert Bosch GmbH, Stuttgart, DE;
Abstract
A micromechanical component including a first composite of a plurality of semiconductor chips, the first composite having a first front and back surfaces, a second composite of a corresponding plurality of carrier substrates, the second composite having a second front and back surfaces; wherein the first front surface and the second front surface are connected via a structured adhesion promoter layer in such a way that each semiconductor chip is connected, essentially free of cavities, to a corresponding carrier substrate corresponding to a respective micromechanical component.