The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2014
Filed:
Jul. 16, 2013
Robert Bosch Gmbh, Stuttgart, DE;
Johannes Classen, Reutlingen, DE;
Mirko Hattass, Stuttgart, DE;
Lars Tebje, Reutlingen, DE;
Daniel Christoph Meisel, Reutlingen, DE;
Robert Bosch GmbH, Stuttgart, DE;
Abstract
A micromechanical structure, in particular a sensor arrangement, includes at least one micromechanical functional layer, a CMOS substrate region arranged below the at least one micromechanical functional layer, and an arrangement of one or more contact elements. The CMOS substrate region has at least one configurable circuit arrangement. The arrangement of one or more contact elements is arranged between the at least one micromechanical functional layer and the CMOS substrate region and is electrically connected to the micromechanical functional layer and the circuit arrangement. The configurable circuit arrangement is designed in such a way that the one or more contact elements are configured to be selectively connected to electrical connection lines in the CMOS substrate region.