The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2014

Filed:

Aug. 22, 2011
Applicants:

Karl Weidner, Munich, DE;

Johann Ramchen, Altdorf, DE;

Axel Kaltenbacher, Mintraching, DE;

Walter Wegleiter, Nittendorf, DE;

Bernd Barchmann, Regensburg, DE;

Inventors:

Karl Weidner, Munich, DE;

Johann Ramchen, Altdorf, DE;

Axel Kaltenbacher, Mintraching, DE;

Walter Wegleiter, Nittendorf, DE;

Bernd Barchmann, Regensburg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/60 (2010.01); H01L 23/00 (2006.01); H01L 23/055 (2006.01); H01L 33/50 (2010.01); H01L 33/54 (2010.01);
U.S. Cl.
CPC ...
H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 24/18 (2013.01); H01L 23/055 (2013.01); H01L 33/505 (2013.01); H01L 33/54 (2013.01);
Abstract

An optoelectronic component includes a carrier having a first connection region and a second connection region, a radiation-emitting semiconductor chip having a base surface and a radiation exit surface opposite the base surface, wherein the semiconductor chip is arranged by the base surface on the carrier, a housing having a lower housing part arranged on the carrier and adjoining side flanks of the semiconductor chip, and an upper housing part arranged on the lower housing part and shaped as a reflector for radiation emitted by the semiconductor chip, and an electrical connection layer which leads from the radiation exit surface of the semiconductor chip via a part of the interface between the lower and the upper housing part and through the lower housing part to the first connection region on the carrier.


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