The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2014

Filed:

Sep. 30, 2011
Applicants:

Matthew Clark, Morristown, NJ (US);

Craig A. Galbrecht, Morristown, NJ (US);

George Goblish, Morristown, NJ (US);

Myles Koshiol, Morristown, NJ (US);

Inventors:

Matthew Clark, Morristown, NJ (US);

Craig A. Galbrecht, Morristown, NJ (US);

George Goblish, Morristown, NJ (US);

Myles Koshiol, Morristown, NJ (US);

Assignee:

Honeywell International Inc., Morristown, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/09027 (2013.01); H05K 2201/09854 (2013.01); H05K 2201/068 (2013.01);
Abstract

An apparatus includes a sheet of circuit board material, at least one electrically conductive trace positioned on the sheet of circuit board material, and at least one electrically conductive contact pad positioned on the sheet of circuit board material and coupled to the at least one electrically conductive trace. The apparatus further includes at least one deformation point configured to absorb stresses developed in the sheet of circuit board material when the sheet of circuit board material experiences resistance to expansion or compression caused by connection to an object resisting expansion or compression.


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