The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2014
Filed:
Oct. 20, 2010
Hiroyuki Kurimura, Shibukawa, JP;
Isamu Ichikawa, Shibukawa, JP;
Takayuki Nagumo, Shibukawa, JP;
Takako Hoshino, Shibukawa, JP;
Jun Watanabe, Shibukawa, JP;
Hiroyuki Kurimura, Shibukawa, JP;
Isamu Ichikawa, Shibukawa, JP;
Takayuki Nagumo, Shibukawa, JP;
Takako Hoshino, Shibukawa, JP;
Jun Watanabe, Shibukawa, JP;
Denki Kagaku Kogyo Kabushiki Kaisha, Tokyo, JP;
Abstract
Provided is an adhesive (meth)acrylic resin composition being high in adhesiveness and capable of affording an adhered body which can be used at high temperatures of 250° C. or higher, and possessing low outgassing property and heat resistance. A (meth)acrylic resin composition including (A) a polyfunctional (meth)acrylate, and (B) a photopolymerization initiator that exhibits a mass loss on heating of 15% by mass or less when increasing temperature from 30° C. to 250° C. at a temperature increase rate of 10° C./min. under nitrogen flow, wherein the glass transition temperature of a cured body obtained from the composition is 250° C. or higher.