The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2014

Filed:

Nov. 19, 2013
Applicant:

University of Windsor, Windsor, CA;

Inventors:

Mordechay Schlesinger, Windsor, CA;

Robert Andrew Petro, Windsor, CA;

Assignee:

University of Windsor, Windsor, CA;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/285 (2006.01);
U.S. Cl.
CPC ...
H01L 21/28506 (2013.01);
Abstract

A plating bath for electroless deposition of gold and gold alloy layers on such silicon-based substrates, includes Na(AuCl) and/or other gold (III) chloride salts as a gold ion source. The bath is formed as a binary bath solution formed from mixing first and second bath components. The first bath component includes gold salts in concentrations up to 40 g/L, boric acid, in amounts of up to 30 g/L, and a metal hydroxide in amounts up to 20 g/L. The second bath component includes an acid salt, in amounts up to 25 g/L, sodium thiosulfate in amounts up to 30 g/L, and suitable acid, such as boric acid in amounts up to 20 g/L.


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