The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2014
Filed:
Nov. 19, 2012
Applicant:
Memc Singapore, Pte. Ltd, Singapore, SG;
Inventors:
Dale A. Witte, Wentzville, MO (US);
Jihong John Chen, St. Charles, MO (US);
Travis L. Hambach, Warrenton, MO (US);
Linda K. Swiney, St. Charles, MO (US);
Assignee:
MEMC Singapore Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); C30B 33/00 (2006.01); C30B 35/00 (2006.01); B28D 5/04 (2006.01); B23D 1/00 (2006.01); C30B 33/06 (2006.01);
U.S. Cl.
CPC ...
B23D 1/00 (2013.01); B28D 5/04 (2013.01); C30B 35/00 (2013.01); C30B 33/06 (2013.01);
Abstract
A method of producing rectangular seed bricks for use in semiconductor or solar manufacturing is disclosed. The method includes connecting an alignment layer to a top surface of a template, drawing alignment lines on the alignment layer to demarcate a plurality of nodes, connecting cylindrical rods to the alignment layer such that a center of each rod is aligned with a corresponding node, and slicing through the rods and the alignment layer with a wire web to produce rectangular seed bricks.