The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2014

Filed:

Apr. 13, 2007
Applicants:

Junya Maruyama, Kanagawa, JP;

Yasuhiro Jinbo, Tokyo, JP;

Hironobu Shoji, Tokyo, JP;

Hideaki Kuwabara, Kanagawa, JP;

Shunpei Yamazaki, Tokyo, JP;

Inventors:

Junya Maruyama, Kanagawa, JP;

Yasuhiro Jinbo, Tokyo, JP;

Hironobu Shoji, Tokyo, JP;

Hideaki Kuwabara, Kanagawa, JP;

Shunpei Yamazaki, Tokyo, JP;

Assignee:

Semiconductor Energy Laboratory Co., Ltd., Atsugi-shi, Kanagawa-ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01); H01L 21/78 (2006.01); H01L 51/00 (2006.01); H01L 27/12 (2006.01); H01L 23/64 (2006.01); G06K 19/077 (2006.01); H01L 23/66 (2006.01); G02F 1/167 (2006.01); H01L 23/498 (2006.01); G02F 1/136 (2006.01);
U.S. Cl.
CPC ...
H01L 21/7806 (2013.01); H01L 51/003 (2013.01); H01L 27/1214 (2013.01); H01L 23/645 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/12044 (2013.01); G02F 1/167 (2013.01); G06K 19/07749 (2013.01); H01L 23/66 (2013.01); H01L 51/0097 (2013.01); H01L 23/49855 (2013.01); H01L 2223/6677 (2013.01); H01L 27/1266 (2013.01); G02F 2001/13613 (2013.01); H01L 2924/3011 (2013.01); Y02E 10/549 (2013.01);
Abstract

A technique for peeling an element manufactured through a process at relatively low temperature (lower than 500° C.) from a substrate and transferring the element to a flexible substrate (typically, a plastic film). With the use of an existing manufacturing device for a large glass substrate, a molybdenum film (Mo film) is formed over a glass substrate, an oxide film is formed over the molybdenum film, and an element is formed over the oxide film through a process at relatively low temperature (lower than 500° C.). Then, the element is peeled from the glass substrate and transferred to a flexible substrate.


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