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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8900933 B1

PDFFull Text
Expired
Date of Patent:
Dec. 02, 2014

Filed:

Nov. 10, 2011

Semiconductor module, molding apparatus, and molding method

Applicants:

Shuuji Adachi, Tokyo, JP;

Fumiyuki Komiyama, Yokohama, JP;

Shuuji Kobayashi, Yokohama, JP;

Inventors:

Shuuji Adachi, Tokyo, JP;

Fumiyuki Komiyama, Yokohama, JP;

Shuuji Kobayashi, Yokohama, JP;

Assignee:

Nissan Motor Co., Ltd., Yokohama-shi, JP;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Scott B Geyer

Assistant Examiner:

Evren Seven

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/00 (2006.01); H01L 21/67 (2006.01); B29C 45/14 (2006.01); H01L 25/07 (2006.01); H01L 21/56 (2006.01); B29C 45/37 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67126 (2013.01); H01L 24/33 (2013.01); B29C 45/14655 (2013.01); H01L 25/072 (2013.01); H01L 21/565 (2013.01); B29C 45/37 (2013.01); H01L 25/50 (2013.01); B29C 45/14418 (2013.01);
Abstract

A semiconductor module includes a plurality of semiconductor elements, a first tabular electrode coupled to one face side of the plurality of semiconductor elements, a second tabular electrode coupled to the other face side of the plurality of semiconductor elements, and a molding material that encapsulates the plurality of semiconductor elements between the first electrode and the second electrode. A protrusion extending toward the second electrode is provided in a circumferential edge portion of the first electrode, and the protrusion surrounds the molding material.

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Quick Actions:

Adachi, Shuuji. (2014). Semiconductor module, molding apparatus, and molding method (U.S. Patent No. 8900933). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8900933

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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