The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2014

Filed:

Mar. 07, 2013
Applicant:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventors:

Yoshihiro Yoneda, Isehara, JP;

Hirohiko Kobayashi, Machida, JP;

Ryuji Masuyama, Yokohama, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01S 5/042 (2006.01); H01S 5/22 (2006.01); H01S 5/028 (2006.01); H01S 5/30 (2006.01); H01S 5/20 (2006.01);
U.S. Cl.
CPC ...
H01S 5/028 (2013.01); H01S 5/0425 (2013.01); H01S 5/22 (2013.01); H01S 2301/176 (2013.01); H01S 5/2086 (2013.01); H01S 5/30 (2013.01);
Abstract

A method for producing an optical semiconductor device includes the steps of forming a semiconductor structure; forming a mask on the semiconductor structure; etching the semiconductor structure with the mask to form first and second stripe-shaped grooves and a mesa portion; forming a protective film on a top surface and side surfaces of the mesa portion; forming a resin portion on the protective film; etching the resin portion and the protective film formed on the top surface; forming an upper electrode on the top surface; and forming an electrical interconnection on the resin portion. The resin portion has an inclined surface region that rises from a first point above the mesa portion toward a second point above the first stripe-shaped groove. The step of etching the resin portion and the protective film includes the substeps of etching the resin portion and simultaneously etching the resin portion and the protective film.


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