The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2014

Filed:

Aug. 28, 2012
Applicants:

Ewald Karl Michael Guenther, Regenstauf, DE;

Jörg Erich Sorg, Regensburg, DE;

Norbert Stath, Regensburg, DE;

Inventors:

Ewald Karl Michael Guenther, Regenstauf, DE;

Jörg Erich Sorg, Regensburg, DE;

Norbert Stath, Regensburg, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 33/62 (2010.01); H01L 33/52 (2010.01); H01L 23/00 (2006.01); H01L 33/54 (2010.01); H01L 33/50 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01023 (2013.01); H01L 2224/82039 (2013.01); H01L 2924/01013 (2013.01); H01L 2224/24226 (2013.01); H01L 2924/01006 (2013.01); H01L 33/508 (2013.01); H01L 33/52 (2013.01); H01L 24/82 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01005 (2013.01); H01L 2224/24998 (2013.01); H01L 2924/01082 (2013.01); H01L 24/24 (2013.01); H01L 2924/01051 (2013.01); H01L 2224/82007 (2013.01); H01L 2924/12041 (2013.01); H01L 33/54 (2013.01); H01L 2224/24051 (2013.01); H01L 2924/01058 (2013.01);
Abstract

In a method for producing a radiation-emitting optoelectronic component, a semiconductor chip is mounted by a first main area onto a carrier body and is electrically conductively connected at a first contact area to a first connection region, and a transparent electrically insulating encapsulation layer is applied to the chip and the carrier body. A first cutout in the encapsulation layer for at least partly uncovering a second contact area of the chip is produced, and a second cutout in the encapsulation layer for at least partly uncovering a second connection region of the carrier body is produced. Finally, an electrically conductive layer, which electrically conductively connects the second contact area of the semiconductor chip and the second connection region of the carrier body, is applied.


Find Patent Forward Citations

Loading…