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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8900531 B1

PDFFull Text
Date of Patent:
Dec. 02, 2014

Filed:

Oct. 29, 2010

Method for bonding plastic micro chip

Applicants:

Jun Keun Chang, Seoul, KR;

Dae Sung Hur, Kyungsan-Si, KR;

Chanil Chung, Uniwang-Si, KR;

Jun Ha Park, Suwon-Si, KR;

Han Sang JO, Anyang-Si, KR;

Inventors:

Jun Keun Chang, Seoul, KR;

Dae Sung Hur, Kyungsan-Si, KR;

Chanil Chung, Uniwang-Si, KR;

Jun Ha Park, Suwon-Si, KR;

Han Sang Jo, Anyang-Si, KR;

Assignee:

Nanoentek Inc., Seoul, KR;

Attorney:
Primary Examiner:

Paul Hyun

Int. Cl.
CPC ...
B01L 99/00 (2010.01); H01L 25/04 (2014.01); B29C 65/08 (2006.01); B29C 65/54 (2006.01); B29C 65/00 (2006.01); B01L 3/00 (2006.01); B29C 59/14 (2006.01); B29C 65/02 (2006.01); B29C 65/14 (2006.01); B29C 65/16 (2006.01); B29C 65/48 (2006.01); B29K 23/00 (2006.01); B29K 25/00 (2006.01); B29K 33/00 (2006.01); B29K 69/00 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/046 (2013.01); B01L 3/5027 (2013.01); B01L 3/502707 (2013.01); B01L 2200/12 (2013.01); B01L 2300/0816 (2013.01); B01L 2300/0825 (2013.01); B01L 2300/0887 (2013.01); B29C 59/14 (2013.01); B29C 65/02 (2013.01); B29C 65/08 (2013.01); B29C 65/14 (2013.01); B29C 65/16 (2013.01); B29C 65/48 (2013.01); B29C 65/4895 (2013.01); B29C 65/54 (2013.01); B29C 65/548 (2013.01); B29C 66/02 (2013.01); B29C 66/3022 (2013.01); B29C 66/54 (2013.01); B29K 2023/06 (2013.01); B29K 2023/12 (2013.01); B29K 2025/00 (2013.01); B29K 2033/12 (2013.01); B29K 2069/00 (2013.01); B29K 2995/0026 (2013.01); B29L 2031/756 (2013.01); B29C 66/8322 (2013.01); B29C 66/542 (2013.01); B29C 66/53461 (2013.01);
Abstract

Disclosed is a method of bonding upper and lower substrates for manufacturing a plastic micro chip comprising the upper substrate, the lower substrate and a sample filling space having a predetermined height for filling a sample between the upper and lower substrates. According to the method, the upper and lower substrates are bonded by introducing an organic solvent between the upper and lower substrates. In addition, the invention provides a method of manufacturing a micro chip using the method and a micro chip manufactured according to the method. According to the invention, it is possible to easily and precisely bond the upper and lower substrates of the plastic micro chip.

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