The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2014
Filed:
Apr. 22, 2005
Martin Philip Rosenblum, Menlo Park, CA (US);
Xi Chu, Fremont, CA (US);
Lorenza Moro, San Carlos, CA (US);
Kenneth Jeffrey Nelson, Sunnyvale, CA (US);
Paul Burrows, Kennewick, WA (US);
Mark E. Gross, Pasco, WA (US);
Mac R. Zumhoff, Kennewick, WA (US);
Peter M. Martin, Kennewick, WA (US);
Charles C. Bonham, Richland, WA (US);
Gordon L. Graff, West Richland, WA (US);
Martin Philip Rosenblum, Menlo Park, CA (US);
Xi Chu, Fremont, CA (US);
Lorenza Moro, San Carlos, CA (US);
Kenneth Jeffrey Nelson, Sunnyvale, CA (US);
Paul Burrows, Kennewick, WA (US);
Mark E. Gross, Pasco, WA (US);
Mac R. Zumhoff, Kennewick, WA (US);
Peter M. Martin, Kennewick, WA (US);
Charles C. Bonham, Richland, WA (US);
Gordon L. Graff, West Richland, WA (US);
Samsung Display Co., Ltd., Yongin, KR;
Abstract
A tool for depositing multilayer coatings onto a substrate. In one configuration, the tool includes a includes an in-line organic material deposition station operating under at least one of a pressure or temperature controlled environment. In another, it further is of a hybrid design that incorporates both in-line and cluster tool features. In this latter configuration, at least one of the deposition stations is configured to deposit an inorganic layer, while at least one other deposition station is configured to deposit an organic layer. The tool is particularly well-suited to depositing multilayer coatings onto discrete substrates, as well as to encapsulating environmentally-sensitive devices placed on the flexible substrate.