The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2014

Filed:

Apr. 02, 2012
Applicants:

Hiroshi Kaneko, Inuyama, JP;

Michitoshi Inagaki, Inuyama, JP;

Tsuyoshi Nakashima, Inuyama, JP;

Inventors:

Hiroshi Kaneko, Inuyama, JP;

Michitoshi Inagaki, Inuyama, JP;

Tsuyoshi Nakashima, Inuyama, JP;

Assignee:

Daido Metal Company Ltd., Nagoya-Shi, Aichi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F16C 33/14 (2006.01); F16C 43/02 (2006.01); F16C 17/12 (2006.01); F16C 17/02 (2006.01); F16C 33/02 (2006.01);
U.S. Cl.
CPC ...
F16C 33/02 (2013.01); F16C 17/12 (2013.01); F16C 2220/82 (2013.01); F16C 17/022 (2013.01); F16C 33/14 (2013.01); F16C 43/02 (2013.01);
Abstract

A halved sliding bearing () has a recess () formed in a circumferential direction from an outer peripheral edge of a mating surface () of a semi-cylindrical bearing main body (). To prevent formation of a burr to an inside of the recess () during formation of the mating surface (), an entirety of at least one edge segment of a peripheral edge of the recess () opening on a circumferential end surface of a semi-cylindrical member () as an unprocessed body of the bearing main body (), the at least one edge segment intersecting with an axial direction of the member (), is chamfered. The mating surface is formed by cutting the circumferential end surface such that a cutting blade () firstly reaches the chamfered edge in the peripheral edge of the recess (). Thus, the bearing main body is produced.


Find Patent Forward Citations

Loading…