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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8899789 B1

PDFFull Text
Date of Patent:
Dec. 02, 2014

Filed:

Aug. 16, 2012

Lamp module

Applicants:

Chia-tin Chung, Miaoli County, TW;

Shih-neng Tai, Taoyuan County, TW;

Inventors:

Chia-Tin Chung, Miaoli County, TW;

Shih-Neng Tai, Taoyuan County, TW;

Assignee:

Paragon Semiconductor Lighting Technology Co., Ltd., New Taipei, TW;

Attorney:

Li&Cai Intellectual Property (USA) Office

Primary Examiner:

Diane Lee

Assistant Examiner:

Kenny C Sokolowski

Int. Cl.
CPC ...
F21V 23/06 (2006.01); F21V 19/00 (2006.01); F21Y 101/02 (2006.01); H01L 33/60 (2010.01); H01L 25/075 (2006.01); F21Y 105/00 (2006.01); F21Y 113/00 (2006.01);
U.S. Cl.
CPC ...
F21V 19/003 (2013.01); F21Y 2101/02 (2013.01); H01L 33/60 (2013.01); H01L 25/0753 (2013.01); F21Y 2105/003 (2013.01); F21Y 2113/005 (2013.01); F21V 23/06 (2013.01); Y10S 362/80 (2013.01);
Abstract

A lamp module includes a cover structure, a circuit board structure and a multichip package structure, and the circuit board structure and the multichip package structure are sequentially assembled on the bottom side of the cover structure. The cover structure includes a cover body, a plurality of positioning elements disposed on the bottom side of the cover body, and a plurality of retaining elements disposed on the bottom side of the cover body. The cover body has a through opening and a surrounding light-reflecting surface formed on the inner surface of the through opening. The circuit board structure is disposed on the bottom side of the cover body and includes a plurality of conductive pins disposed on the bottom side of the circuit board structure. The multichip package structure is disposed on the bottom side of the cover body and electrically connected to the circuit board structure.

Find Patent Forward Citations

Chung, Chia-Tin. (2014). Lamp module (U.S. Patent No. 8899789). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8899789

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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