The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2014

Filed:

Jun. 14, 2011
Applicants:

Fengzhou Fang, Tianjin, CN;

Yunhui Chen, Tianjin, CN;

Zongwei Xu, Tianjin, CN;

Zhongjun Qiu, Tianjin, CN;

Xiaodong Zhang, Tianjin, CN;

Tengfei Dai, Tianjin, CN;

Xiaotang HU, Tianjin, CN;

Inventors:

Fengzhou Fang, Tianjin, CN;

Yunhui Chen, Tianjin, CN;

Zongwei Xu, Tianjin, CN;

Zhongjun Qiu, Tianjin, CN;

Xiaodong Zhang, Tianjin, CN;

Tengfei Dai, Tianjin, CN;

Xiaotang Hu, Tianjin, CN;

Assignee:

Tianjin University, Tianjin, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 19/00 (2011.01); B24B 1/00 (2006.01); C23C 14/00 (2006.01); B23K 15/00 (2006.01); B23K 26/00 (2014.01); G21K 5/10 (2006.01); H01J 37/08 (2006.01); A61N 5/00 (2006.01); G21G 5/00 (2006.01); B28D 5/00 (2006.01); C30B 29/06 (2006.01); C30B 29/08 (2006.01); C30B 33/04 (2006.01);
U.S. Cl.
CPC ...
B28D 5/00 (2013.01); C30B 29/06 (2013.01); C30B 29/08 (2013.01); C30B 33/04 (2013.01);
Abstract

The invention relates to a new technology which uses a surface modification method for ultra-precision machining, and in particular relates to a particle beam-assisted ultraprecision machining method for single-crystal brittle materials. The invention, the particle beam-assisted ultra-precision machining method for single-crystal brittle materials, can significantly improve machining accuracy, reduce surface finish and greatly reduce tool wear during ultra-precision machining of brittle materials. The method adopts the technical proposal that the method comprises of the following steps: a) utilizing simulation software to simulate modification parameters according to cutting depth, surface roughness and other machining requirements; b) using particle beams to bombard or irradiate the surface of a single-crystal brittle material to be machined, according to the energy and fluence obtained from the simulation results; c) utilizing ultra-precision cutting (or grinding) technology to perform ultra precise cutting on the single-crystal material which is bombarded or irradiated by the particle beams; and d) measuring and characterizing the surface quality of the machined material and comparing the improvement of the machined surface quality with that of the unmodified machined surface. The method is mainly used for machining the single-crystal brittle materials.


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