The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2014
Filed:
Jan. 11, 2013
Renesas Electronics Corporation, Kanagawa, JP;
Kenichiro Hijioka, Kanagawa, JP;
Koichi Yamaguchi, Kanagawa, JP;
Renesas Electronics Corporation, Kanagawa, JP;
Abstract
Disclosed is a semiconductor device including a semiconductor chip and a semiconductor package. The semiconductor package includes an antenna formed of a lead frame, a first wire that connects the antenna and a first electrode pad of the semiconductor chip, and a second wire that connects the antenna and a second electrode pad of the semiconductor chip. The semiconductor chip is disposed in one of four regions in the semiconductor package sectioned by line segments connecting midpoints of two pairs of opposing sides of the semiconductor package. A centroid of the semiconductor chip is positioned outside a closed curve composed of a straight line segment connecting a first connection point where the antenna and the first wire are connected and a second connection point where the antenna and the second wire are connected, and a line connecting the first and second connection points along the antenna.