The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2014

Filed:

Apr. 01, 2014
Applicant:

Panasonic Corporation, Osaka, JP;

Inventors:

Takayuki Yoshida, Shiga, JP;

Naoto Ueda, Hyogo, JP;

Kouji Oomori, Shiga, JP;

Takuma Motofuji, Osaka, JP;

Teruaki Kasai, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01S 3/04 (2006.01); H01S 5/024 (2006.01); H01S 5/022 (2006.01); H01S 5/028 (2006.01);
U.S. Cl.
CPC ...
H01S 5/02461 (2013.01); H01S 5/02272 (2013.01); H01S 5/02268 (2013.01); H01S 5/02469 (2013.01); H01S 5/02492 (2013.01); H01S 5/028 (2013.01);
Abstract

The semiconductor laser device of the present invention has a conductive first heatsink member, a conductive first adhesive, and a semiconductor laser element. The first adhesive is disposed on the first heatsink member, and the semiconductor laser element is disposed on the first adhesive. The first adhesive reaches an upper part of the side surface of the first heatsink member under the laser emission surface for laser emission of the semiconductor laser element. The structure further improves heat dissipation of the semiconductor laser element; at the same time, it is effective in obtaining laser light from the semiconductor laser element.


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