The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2014
Filed:
Dec. 14, 2012
Inventec (Pudong) Technology Corporation, Shanghai, CN;
Inventec Corporation, Taipei, TW;
Feng-Ku Wang, Taipei, TW;
Yi-Lun Cheng, Taipei, TW;
Chih-Kai Yang, Taipei, TW;
Wei-Hsin Wu, Taipei, TW;
Hua-Feng Chen, Taipei, TW;
Ming-Hung Lin, Taipei, TW;
Inventec (Pudong) Technology Corporation, Shanghai, CN;
Inventec Corporation, Taipei, TW;
Abstract
The disclosure provides an electronic device and a heat dissipation module having an imaginary structural plane. The heat dissipation module includes a fin assembly, a connecting part and a heat pipe. The fin assembly is disposed on the structural plane and includes a plurality of fin elements extending along a first direction. The connecting part is connected to the fin elements. The fin elements are connected to each other via the connecting part. At least one portion of the connecting part is connected to at least one portion of the heat pipe, and the connecting part and the heat pipe both extend along a second direction. The fin assembly and the connecting part are integrated and formed into one piece by die casting. The first direction and the second direction form a first included angle greater than 0 degree.