The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2014

Filed:

Mar. 15, 2013
Applicant:

SK Hynix Inc., Gyeonggi-do, KR;

Inventor:

Jong-Ho Jung, Gyeonggi-do, KR;

Assignee:

SK Hynix Inc., Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03K 19/003 (2006.01); H03K 19/00 (2006.01);
U.S. Cl.
CPC ...
H03K 19/0005 (2013.01);
Abstract

An integrated circuit of a multiple die package structure having a plurality of semiconductor devices, each of the plurality of semiconductor devices may include an active termination circuit configured to perform an active termination operation to the semiconductor device, and to be turned off in a disable state of an active termination setting code, a multiple die package information transfer unit configured to transfer a multiple die package information signal, and a compulsory termination unit configured to selectively convert the active termination setting code into the disable state in response to the multiple die package information signal.


Find Patent Forward Citations

Jung, Jong-Ho. (2014). Integrated circuit and operation method thereof (U.S. Patent No. 8896342). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8896342

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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