The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2014
Filed:
Apr. 04, 2011
Applicants:
Yuan LI, Malden, NL;
Som Nath, Arnhem, BE;
Maarten Jeroen Van Dort, Herkenbosch, NL;
Inventors:
Assignee:
NXP B.V., Eindhoven, NL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); H01L 2924/01029 (2013.01); H01L 2224/05086 (2013.01); H01L 2224/45124 (2013.01); H01L 2924/00013 (2013.01); H01L 2924/00014 (2013.01); H01L 2224/0392 (2013.01); H01L 2224/05098 (2013.01); H01L 2224/05096 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05088 (2013.01);
Abstract
A circuit device is configured with robust circuit connectors. In connection with various example embodiments, an integrated circuit device includes one or more via network layers below a bond pad contact, connecting the bond pad contact with one or more underlying metal layers. Each via network layer includes a plurality of via strips extending about parallel to the bond pad contact and in different directions to structurally support the bond pad contact.