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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8896117 B1

PDFFull Text
Date of Patent:
Nov. 25, 2014

Filed:

Nov. 16, 2012

Semiconductor device bonded by an anisotropic conductive film

Applicants:

Youn JO Ko, Uiwang-si, KR;

Jin Kyu Kim, Uiwang-si, KR;

Dong Seon Uh, Uiwang-si, KR;

Kil Yong Lee, Uiwang-si, KR;

Jang Hyun Cho, Uiwang-si, KR;

Inventors:

Youn Jo Ko, Uiwang-si, KR;

Jin Kyu Kim, Uiwang-si, KR;

Dong Seon Uh, Uiwang-si, KR;

Kil Yong Lee, Uiwang-si, KR;

Jang Hyun Cho, Uiwang-si, KR;

Assignee:

Cheil Industries, Inc., Gumi-si, Kyeongsangbuk-do, KR;

Attorney:

Lee & Morse, P.C.

Primary Examiner:

Alexander Oscar Williams

Int. Cl.
CPC ...
H01L 23/52 (2006.01); C09J 9/02 (2006.01); C09J 133/04 (2006.01); C09J 7/00 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/52 (2013.01); C09J 9/02 (2013.01); H01L 24/83 (2013.01); H01L 2224/29444 (2013.01); H01L 24/32 (2013.01); H01L 2224/29311 (2013.01); C09J 2201/134 (2013.01); C09J 2201/606 (2013.01); H01L 2224/29447 (2013.01); C09J 2203/326 (2013.01); H01L 2224/29344 (2013.01); C09J 2433/00 (2013.01); H01L 2224/29393 (2013.01); H01L 2224/29355 (2013.01); H01L 24/29 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/32225 (2013.01); C09J 133/04 (2013.01); H01L 2224/29411 (2013.01); H01L 224/83851 (2013.01); H01L 2224/29455 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/2908 (2013.01); C09J 2201/602 (2013.01); H01L 2224/2939 (2013.01); C09J 7/00 (2013.01); H01L 2224/29439 (2013.01); H01L 2224/29347 (2013.01);
Abstract

A semiconductor device bonded by an anisotropic conductive film, the anisotropic conductive film including a conductive adhesive layer and an insulating adhesive layer stacked thereon, an amount of reactive monomers in the conductive adhesive layer being higher than an amount of reactive monomers in the insulating adhesive layer.

Find Patent Forward Citations

Quick Actions:

Ko, Youn. (2014). Semiconductor device bonded by an anisotropic conductive film (U.S. Patent No. 8896117). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8896117

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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