The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2014

Filed:

Jan. 16, 2014
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Haruki Ito, Chino, JP;

Nobuaki Hashimoto, Suwa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 23/48 (2006.01); H03H 9/05 (2006.01); H03H 9/10 (2006.01); H01L 23/482 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 2924/14 (2013.01); H01L 2224/16 (2013.01); H01L 24/12 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01078 (2013.01); H03H 9/0547 (2013.01); H01L 2924/01046 (2013.01); H03H 9/1071 (2013.01); H01L 2924/01079 (2013.01); H01L 23/4824 (2013.01); H01L 2924/04941 (2013.01); H03H 9/0552 (2013.01);
Abstract

A semiconductor device includes: a semiconductor substrate including a first face and a second face on a side opposite to the first face; an external connection terminal formed on the first face of the semiconductor substrate; a first electrode formed on the first face of the semiconductor substrate and electrically connected to the external connection terminal; an electronic element formed on or above the second face of the semiconductor substrate; a second electrode electrically connected to the electronic element and having a top face and a rear face; a groove portion formed on the second face of the semiconductor substrate and having a bottom face including at least part of the rear face of the second electrode; and a conductive portion formed in the groove portion and electrically connected to the rear face of the second electrode.


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