The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2014
Filed:
Jun. 02, 2010
Applicant:
Hartmud Terletzki, Graz, AT;
Inventor:
Hartmud Terletzki, Graz, AT;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/00 (2006.01); H01L 27/02 (2006.01); H01L 49/02 (2006.01); H01L 27/06 (2006.01); H01L 29/94 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0629 (2013.01); H01L 29/945 (2013.01); H01L 27/0207 (2013.01); H01L 28/65 (2013.01); H01L 29/66181 (2013.01);
Abstract
A semiconductor chip includes a substrate including a surface, an active transistor region and a substrate contact region formed on the substrate, a shallow trench isolation (STI) area formed in the surface and disposed at least partially between the active transistor region and the substrate contact region, and at least one capacitor at least partially buried in the STI area.