The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2014
Filed:
Dec. 20, 2013
Applicant:
Lapis Semiconductor Co., Ltd., Yokohama, JP;
Inventor:
Masahiro Uekawa, Kanagawa, JP;
Assignee:
LAPIS Semiconductor Co., Ltd., Yokohama, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/00 (2006.01); H01L 31/0216 (2014.01); H01L 27/146 (2006.01); H04N 5/225 (2006.01);
U.S. Cl.
CPC ...
H01L 31/02164 (2013.01); H01L 27/14618 (2013.01); H01L 27/14625 (2013.01); H01L 27/14687 (2013.01); H04N 5/2257 (2013.01);
Abstract
A camera module has a sensor chip including a sensor unit formed on a main surface around which sides are disposed. A lens chip is fixed to the sensor chip with a spacer unit and includes a lens unit corresponding to the sensor unit. A light shieldable layer covers a first side of the sensor chip and a side of the spacer unit. A first cutting surface includes a second side of the sensor chip and a side of the light shieldable layer on a same plane.
Uekawa, Masahiro. (2014). Camera module having a light shieldable layer (U.S. Patent No. 8896079). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8896079
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