The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2014

Filed:

Mar. 31, 2010
Applicants:

Atsuo Isobe, Isehara, JP;

Tamae Takano, Atsugi, JP;

Yasuyuki Arai, Atsugi, JP;

Fumiko Terasawa, Atsugi, JP;

Inventors:

Atsuo Isobe, Isehara, JP;

Tamae Takano, Atsugi, JP;

Yasuyuki Arai, Atsugi, JP;

Fumiko Terasawa, Atsugi, JP;

Assignee:

Semiconductor Energy Laboratory Co., Ltd., Atsugi-shi, Kanagawa-ken, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/788 (2006.01); H01L 27/115 (2006.01); H01L 21/84 (2006.01); H01L 27/12 (2006.01); H01L 29/76 (2006.01);
U.S. Cl.
CPC ...
H01L 27/12 (2013.01); H01L 27/11524 (2013.01); H01L 27/115 (2013.01); H01L 21/84 (2013.01); H01L 27/11521 (2013.01);
Abstract

A manufacturing method of a semiconductor device of the present invention includes the steps of forming a stacked body in which a semiconductor film, a gate insulating film, and a first conductive film are sequentially stacked over a substrate; selectively removing the stacked body to form a plurality of island-shaped stacked bodies; forming an insulating film to cover the plurality of island-shaped stacked bodies; removing a part of the insulating film to expose a surface of the first conductive film, such that a surface of the first conductive film almost coextensive with a height of the insulating film; forming a second conductive film over the first conductive film and a left part of the insulating film; forming a resist over the second conductive film; selectively removing the first conductive film and the second conductive film using the resist as a mask.


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