The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2014

Filed:

Jan. 31, 2013
Applicant:

Sony Corporation, Tokyo, JP;

Inventors:

Masahiro Mitsunaga, Kagoshima, JP;

Shinichi Tamari, Kagoshima, JP;

Yuji Ibusuki, Kagoshima, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 21/761 (2006.01); H01L 27/06 (2006.01); H01L 27/02 (2006.01); H01L 21/8252 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0646 (2013.01); H01L 21/761 (2013.01); H01L 27/0605 (2013.01); H01L 27/0296 (2013.01); H01L 21/8252 (2013.01);
Abstract

A semiconductor device includes: an epitaxial substrate formed by stacking a plurality of kinds of semiconductors over one semiconductor substrate by epitaxial growth; a field effect transistor of a first conductivity type formed in a first region; a field effect transistor of a second conductivity type formed in a second region; and a protective element formed in a third region. The protective element includes: a first stacking structure formed by etching the epitaxial substrate by vertical etching that proceeds in a stacking thickness direction; and a second stacking structure formed by etching the epitaxial substrate by vertical etching that proceeds in a stacking thickness direction. The protective element has two PN junctions on a current path formed between an upper end of the first stacking structure and an upper end of the second stacking structure via a base part of the first stacking structure and the second stacking structure.


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