The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2014

Filed:

Jun. 27, 2011
Applicants:

BO Pi, Carlsbad, CA (US);

LI Xu, Saratoga, CA (US);

Inventors:

Bo Pi, Carlsbad, CA (US);

Li Xu, Saratoga, CA (US);

Assignee:

Axlen, Inc., Wilmington, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/64 (2010.01); H01L 33/62 (2010.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 33/64 (2013.01); H01L 33/641 (2013.01); H01L 33/644 (2013.01); H01L 33/642 (2013.01); H01L 33/486 (2013.01); H01L 2224/48247 (2013.01); H01L 2933/0075 (2013.01); H01L 33/62 (2013.01);
Abstract

LED packages and their fabrication techniques are disclosed to provide LED package with improved thermal dissipation based on one or more thermally conductive channels or studs. In one implementation, a LED package includes a plastic body structured to have a hole that penetrates through the plastic body; a metal contact formed on the plastic body at one side of the hole to cover the hole; a LED mounted to the metal contact at a location that spatially overlaps with the hole; and a stud formed in the hole in contact with the metal contact at a first end of the stud and extending to an opening of the hole at a second end of the stud, the stud being formed of a thermally conductive material to transfer heat from the LED through the metal contact and the stud to dissipate the heat at the opening of the hole via the second end of the stud.


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