The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2014

Filed:

Jan. 02, 2013
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Chunlei Zhang, Santa Clara, CA (US);

Richard Fovell, San Jose, CA (US);

Ezra Robert Gold, Sunnyvale, CA (US);

Ajit Balakrishna, Sunnyvale, CA (US);

James P. Cruse, Santa Cruz, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K 10/00 (2006.01); H01L 21/67 (2006.01); H05B 7/18 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H05B 7/18 (2013.01); H01L 21/67069 (2013.01); H01J 2237/2001 (2013.01); H01J 37/32724 (2013.01);
Abstract

Methods and apparatus for regulating the temperature of a component in a plasma-enhanced process chamber are provided herein. In some embodiments, an apparatus for processing a substrate includes a process chamber and an RF source to provide RF energy to form a plasma in the process chamber. A component is disposed in the process chamber so as to be heated by the plasma when formed. A heater is configured to heat the component and a heat exchanger is configured to remove heat from the component. A chiller is coupled to the heat exchanger via a first flow conduit having an on/off flow control valve disposed therein and a bypass loop to bypass the flow control valve, wherein the bypass loop has a flow ratio valve disposed therein.


Find Patent Forward Citations

Loading…