The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2014

Filed:

Oct. 15, 2010
Applicants:

Juergen Sauerbier, Dachsbach, DE;

Wolfgang Gruebl, Winkelhaid, DE;

Bernhard Schuch, Neusitz, DE;

Hubert Trageser, Igensdorf, DE;

Hermann-josef Robin, Regensburg, DE;

Inventors:

Juergen Sauerbier, Dachsbach, DE;

Wolfgang Gruebl, Winkelhaid, DE;

Bernhard Schuch, Neusitz, DE;

Hubert Trageser, Igensdorf, DE;

Hermann-Josef Robin, Regensburg, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0206 (2013.01); H05K 1/0373 (2013.01); H05K 2201/0209 (2013.01);
Abstract

A circuit board has a plurality of circuit board layers that are arranged one over the other, and that each include an electrically insulating base material having a glass transition temperature greater than or equal to 170° C. The circuit board layers each further have at least one thermally conductive layer applied to the base material. Several vias extend through respective ones of the circuit board layers to connect thermally conductive layers of different circuit board layers, such that the vias and the thermally conductive layers form a thermally conductive bridge from a topmost circuit board layer to a bottommost circuit board layer.


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